Sn96.5Ag3.0Cu0.5

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Sn96.5Ag3.0Cu0.5 (SAC 305) Solder Balls

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Certificate of Conformance for Sn96.5Ag3.0CU0.5

EasySpheres SAC305 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.

Alloy Melt Temperature : 221(°C)

CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
Size and Tolerance Spec


Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.

Download Data Sheet Download SDS Sheet

EasySpheres Technical Data Sheet SAC 305 (2023-Rev7.pdf)

SAC305 SDS Sheet REV D.pdf

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.

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