Sn98.5Ag1Cu0.5 (SAC105) Solder Balls
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* In Stock items ordered by 2:00 Pacific Time Ship same day !
* Selected sizes chosen below arein STOCK and will ship immediately.
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* For 1,000,000 Spheres you receive an 88% discount against base price.
* Much larger discounts are available based on quantity ordered.
* Ask for a custom quote for more than 5,000,000.
- Description & Specs.
- Data Sheets and SDS
EasySpheres Sn98.5Ag1Cu0.5 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.
Alloy Melt Temperature : 217 - 226 (°C)
CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.
| Download | Data Sheet | Download | SDS Sheet |
| | EasySpheres Technical Data Sheet SAC105_REV7.pdf | | SAC105 SDS Sheet REV A.pdf |
EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)
Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.
