EasySpheres taped solder spheres now allows you to use your existing pick and place equipment to automate the placement of our spheres for all of your re-balling projects. Packaged with industry standard 8mm polycarbonate tape, in compliance to EIA-481-E standard, our taped spheres will work with most pick and place tape feeders. Leverage your un-used placement machine capacity while gaining the benefits of accuracy and speed of your existing pick and place platform.
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EasySpheres SAC305 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.
Alloy Melt Temperature : 221(°C)
CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS
WARRANTY INFORMATION
EasySpheres warrants this product to be defect free, with a controlled size distribution per industry specifications and a alloy purity which is in compliance of IPC-JSTD-006 guidelines.
Size deviation shall not be greater than:
Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.
| Download | Data Sheet | Download | SDS Sheet |
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EasySpheres Technical Data Sheet SAC 305 (2023-Rev7.pdf) |
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