Sn63Pb37

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Sn63Pb37 Solder Balls

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* Selected sizes chosen below are in STOCK and will ship immediately.




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* For 1,000,000 Spheres you receive an 88% discount against base price.
* Much larger discounts are available based on quantity ordered.
* Ask for a custom quote for more than 5,000,000.


Certificate of Conformance for Sn63Pb37 Solder Spheres

EasySpheres Sn63Pb37 Solder Spheres are manufactured and designed to support optimized ball-attach applications of ball grid array (BGA) and chip scale package (CSP) components. EasySpheres Solder Balls are packaged to resist surface darkening induced by transit tumbling which offers reduced machine vision faults in ball placement systems. We package your product in medical grade ESD Safe containers.

Alloy Melt Temperature : 183(°C)

CERTIFICATE OF CONFORMANCE SHIPS WITH ALL ORDERS


 

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
Size and Tolerance Spec


Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.

Download Data Sheet Download SDS Sheet

EasySpheres Technical Data Sheet Sn63Pb37 (2023-Rev7.pdf)

Sn63Pb37 SDS Sheet Rev D.pdf

EasySpheres warrants this product to be defect free, with alloy purity in compliance of IPC-JSTD-006 guidelines.

Size deviation shall not be greater than:
± 0.010% for sizes .0.004" ~ 0.018" (0.100mm~0.450mm)
± 0.015% for Sizes 0.020" ~ 0.022" (0.500mm~0.550mm)
± 0.020% for Sizes 0.024" ~ 0.035" (0.600mm~0.889mm)

Shelf life of 1 year is guaranteed by EasySpheres from date of purchase.